Data Scientist, Semiconductor Manufacturing Analytics (Advanced Packaging) at Intel (Phoenix)
Job Description
Intel’s Advanced Packaging Technology and Manufacturing organisation in Phoenix is hiring a data scientist to apply statistics, machine learning and AI to thermal compression bonding and other advanced packaging processes. The goal is better process control, yield and tool health, built together with process, equipment, metrology and quality engineers.
At a glance
- Team: Advanced Packaging Technology and Manufacturing (APTM)
- Location: Phoenix, Arizona
- Focus: ML for process control and yield in advanced packaging
- Apply: open until filled (re-checked 14 October 2026)
What you would do
- Analyse manufacturing, process, equipment, metrology and yield data to find trends, anomalies and root causes
- Develop ML models for process monitoring, excursion detection, yield prediction, defect patterns and tool drift
- Build proofs of concept for predictive analytics in thermal compression bonding
- Support advanced process control and deploy practical tools in production
- Create dashboards and automated analysis tools
Why this role matters
Advanced packaging, which stacks and connects several chiplets in one package, is now as important to chip performance as the transistors themselves. Thermal compression bonding is one of its key steps, and yield problems there are costly. Data science that catches drift or predicts defects early directly saves money and time in production.
What Intel is looking for
- Strong statistics, predictive modelling and large-scale data analysis skills
- Ability to translate manufacturing problems into analytical solutions
- Experience working with engineering teams in a production setting
Nice to have
- Semiconductor manufacturing or packaging domain knowledge
Pay and location
Intel lists a US pay range on the posting for this Arizona role; check it there.
How to apply
Apply through the official Intel job posting. Intel’s posting does not give a closing date, so the role is open until filled; ResearchJobs.in will re-check this listing on 14 October 2026. Check the posting for location and work-authorisation details before you apply.
See all our industry R&D jobs, or browse more research jobs on ResearchJobs.in.
Hiring institution: Intel
Official advertisement: intel.wd1.myworkdayjobs.com
How to prepare for this application
- Manufacturing data: show projects on process, tool or yield data.
- Production use: models that engineers actually used matter more than notebooks.
- Packaging interest: read up on thermal compression bonding and chiplets.
- Stats plus ML: both are named; show both.
About Intel
Intel designs and manufactures processors and other silicon, and offers foundry and advanced packaging services to other chip companies. Its US sites in Oregon and Arizona host much of its process technology, device modelling and manufacturing work.
